格胜超声波清洗机系列—ULTRASONIC EQUIPMENT

  Guyson 'Kerry' ultrasonic cleaning equipment includes both aqueous and solvent systems for precision cleaning and degreasing.

SOLVENT CLEANING SYSTEMS

 
Microsolve ultrasonic precision cleaning systems attain the highest cleaning standards yet keep running costs surprisingly low.
Users have a choice of processes: in broad terms MONO-SOLVENT for general precision cleaning, CO-SOLVENT where contamination is particularly heavy or for some applications in electronics, and 3-SUMP for certain special applications.

Options

Options include dual frequency ultrasonics, solvent monitoring with auto top-up, and a choice of Autotrans robotic work handling systems.

Low Solvent Usage

Solvent retention features unique to Microsolve systems - triple coil reflux cooling, vapour break, 150% freeboard, optional solvent monitoring and auto top-up - ensure that our systems are safe to use and fully compliant with environmental and safety legislation. These design features also mean that Microsolve systems operate with low, predictable solvent usage and customers enjoy low, predictable running costs.
Our solvent monitoring device allows users to check consumption: 3 litres of HFE per 40-hour week is typical in a Co-solvent 350 system.

Microsolve Mono-Solvent

  Two-stage systems provide ultrasonic cleaning using HFE (hydrofluoroether) or HFC (hydrofluoro-carbon) solvents, followed by vapour rinsing and freeboard dry.
  Typical applications include bearings, gyro components and precision medical components; maintenance cleaning of pneumatic and hydraulic components; and, in electronics, flux removal from PCBs or from soldering jigs and fixtures.

Microsolve Co-solvent

  Systems provide two ultrasonic cleaning stages, followed by vapour rinsing and freeboard dry. In the first cleaning stage a mixture of HFE and a hydrocarbon solvating agent removes gross contamination from the components. Large quantities of dirt and oils can be taken up by the solvating agent, making the process particularly suitable for heavy duty ultrasonic cleaning applications.
The Co-solvent process handles with ease applications such as removal of polishing compounds, maintenance cleaning of power generation system components, and flux removal from PCBs, including no-clean and lead-free solder flux residues.

MICROSOLVE 3-SUMP SYSTEMS

  Microsolve 3-sump systems are available for certain special applications. In the system shown, stage 1 provides ultrasonic cleaning and stage 2 an immersion rinse. This is followed by vapour rinsing (provided by sump 3) and freeboard dry.
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MULTI-STAGE AQUEOUS ULTRASONIC CLEANERS

The standard Microclean 4-stage aqueous cleaning system (heated ultrasonic clean, rinse, rinse, warm air dry) suits a wide range of cleaning needs in aerospace, automotive, electronics and other industries. Closed loop high purity deionised water rinsing provides organic and ionic cleanliness superior to MIL standard.
Standard Microclean features include undersurface jets and weir overflow to all wet stages.
  Options include:
  · Pre-clean module with oil separator for heavy duty cleaning
  · Ultrasonics to rinse stages
  · Vertical agitation to all wet stages
  · Double capacity hot air drying for increased throughput
The Microclean's modular design means that additional stages can be added to meet a variety of process requirements. A 3-stage system (heated ultrasonic clean, rinse, warm air dry) is also available.
Microclean systems may be operated manually, fitted with lift, or fitted with Autotrans Mk4 automation, when the Microclean's PLC-based control system interfaces with the Autotrans to provide fully automatic operation.

Microclean Systems for Precision Optics and Ophthalmics

  Microclean 4-stage systems are suitable for many less demanding applications in the optical industry such as removal of blocking wax and cerium oxide prior to inspection. Appropriate options may include vertical agitation to the cleaning tanks, ultrasonics to the rinse stages, and Class 100 HEPA filtration to the dryer.
Microclean systems of 5 stages and upwards are configurable to suit glass and plastic cleaning applications such as glass moulds, precision optics, contact lenses prior to sterile packaging, and organic and mineral lenses prior to hard coating and/or AR coating. The Microclean's modular design means that systems can be extended to meet a wide variety of process requirements.
Microclean systems may be operated manually or fitted with Autotrans Mk4 automation, when the Microclean's PLC-based control system interfaces with the Autotrans to provide fully automatic operation.
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STENCIL CLEANER

The Microclean SC1000 cleans SMT stencils and misprinted PCBs, removing solder paste and adhesives to the highest cleaning standards.
Operation is fully automatic, with PLC-based controls. The operator simply places the stencil inside the chamber, selects from up to eight programs, closes the interlocking lid and presses the ‘Start Cycle’ button.
Cleaning is by motorised rotating spray jets (the system does not use ultrasonics) pump pressurised at up to 60 litres/minute and 4 bar. This is followed by air purging, DI rinsing, a further air purge, and warm air drying.
The SC1000 stencil cleaner uses safe and economic aqueous chemistry with closed loop operation to minimise waste effluent.
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SUPERCLEANERS

Supercleaners are designed to meet the most demanding component cleaning requirements of the precision engineering sector and are intended for clean room installations.
Supercleaners provide multi-stage aqueous ultrasonic cleaning and high purity deionised water rinsing, multi-frequency variable power ultrasonics, and hot air drying to remove organic residues down to ppb (parts per billion) levels and particulate contamination to 0.1 microns.
The process is well established for high specification high volume cleaning applications, including computer disk drive components such as base castings, top covers and HSAs.
Multi-head Autotrans automation with pick and place operation allows each Autotrans head to release baskets in process tanks while performing other transfers. Autotrans program intelligence continuously monitors basket positions to maximise throughput and system integrity.
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